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CoolRunner XPLA3 Data Sheets

DateName
05/26/2009 CoolRunner XPLA3 CPLD Family(PDF, ver 2.5, 172 KB )

The CoolRunner™ XPLA3 (eXtended Programmable Logic Array) family of CPLDs is targeted for low power systems that include portable, handheld, and power-sensitive applications. Each member of the XPLA3 family includes Fast Zero Power (FZP) design technology that combines low power and high speed.

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03/31/2006 XCR3512XL: 512 Macrocell CoolRunner CPLD(PDF, ver 2.0, 227 KB )

The XCR3512XL is a 3.3V, 512 macrocell CPLD targeted at power-sensitive designs that require leading edge programmable logic solutions.

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03/31/2006 XCR3384XL: 384 Macrocell CoolRunner CPLD(PDF, ver 2.0, 227 KB )

The XCR3384XL is a 3.3V, 384 macrocell CPLD targeted at power-sensitive designs that require leading edge programmable logic solutions.

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03/31/2006 XCR3256XL: 256 Macrocell CoolRunner CPLD(PDF, ver 2.7, 434 KB )

The XCR3256XL is a 3.3V, 256 macrocell CPLD targeted at power-sensitive designs that require leading edge programmable logic solutions. A total of 16 function blocks provide 6,000 usable gates.

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03/31/2006 XCR3128XL: 128 Macrocell CPLD(PDF, ver 2.6, 215 KB )

The XCR3128XL is a 3.3V 128 macrocell CPLD targeted at power-sensitive designs that require leading edge programmable logic solutions. A total of eight function blocks provide 3,000 usable gates.

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09/15/2008 XCR3064XL: 64 Macrocell CoolRunner CPLD(PDF, ver 2.4, 158 KB )

The XCR3064XL is a 3.3V, 64-macrocell CPLD targeted at power-sensitive designs that require leading edge programmable logic solutions. A total of four function blocks provide 1,500 usable gates.

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09/15/2008 XCR3032XL 32 Macrocell CoolRunner CPLD(PDF, ver 2.2, 219 KB )

The XCR3032XL is a 3.3V, 32- CPLD targeted at power-sensitive designs that require leading edge programmable logic solutions. A total of two function blocks provide 750 usable gates.

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CoolRunner XPLA3 User Guides

DateName
11/27/2007 CPLD I/O User Guide(PDF, ver 1.1, 610 KB )

This document describes the behavior of the I/Os under various operating conditions. It describes how to use the different termination modes, how to understand thresholds, and how loading affects the I/Os.

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09/22/2010 Device Package User Guide(PDF, ver 3.6, 4.89 MB )

This document discusses thermal, electrical, moisture, and soldering characteristics of Xilinx® device packages.

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05/08/2012 Device Reliability Report, First Quarter 2012(PDF, ver 9.0, 2.18 MB )

Summary of the reliability test data and results for Xilinx devices updated four times per year.

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CoolRunner XPLA3 Errata

DateName
05/21/2004 CoolRunner XPLA3 Errata(PDF, ver 1.0, 136 KB )

CoolRunner™ XPLA3 CPLD Errata DS012-E10: Incorrect initialization under an obscure power condition.

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CoolRunner XPLA3 Customer Notices

DateName
10/19/2000 PDN2000-07: Products Affected(PDF, ver 1.0, 110 KB )
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10/19/2000 PDN2000-07 - Discontinuation of certain XPLA CPLD Families(PDF, ver 1.0, 159 KB )
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07/01/1999 PDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families(PDF, ver 1.0, 24 KB )
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03/20/2000 PCN00002a - A change in the assembly and test flows used to manufacture the Xilinx CoolRunner(PDF, ver 1.0, 35 KB )
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03/28/2001 PCN00002A Data - Cross Reference List for PCN00002A (PDF, ver 1.0, 38 KB )
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01/30/2000 PCN00002 - A change in the assembly and test flows used to manufacture the Xilinx CoolRunner(PDF, ver 1.0, 38 KB )
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03/28/2001 PCN00002 Data - Cross Reference List for PCN00002 (PDF, ver 1.0, 38 KB )
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08/19/2003 Advisory 2003-02 - Change in BGA Shipping Trays(PDF, ver 1.0, 43 KB )

Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both Daewon and Kostat.

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06/29/2001 Advisory2001-02 - CoolRunner CPLD Fitter Software Update Needed for the XCR3064XL-PC44 (PDF, ver 1.0, 20 KB )
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12/06/2004 PCN2004-28 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 161 KB )

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

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11/08/2004 Xilinx PCN2004-23: Circuit revision change to the XPLA3 family of CPLD devices(PDF, ver 2.0, 50 KB )

Updated availability dates: For XCR3032XL change from March 2005 to January 2005. For XCR3128XL change from December 2004 to January 2005.

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12/06/2004 PCN2004-05 - New Material Set and Part Marking for Chip Scale BGA Packages(PDF, ver 1.1, 72 KB )
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12/06/2004 PCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material)(PDF, ver 1.1, 72 KB )
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11/26/2003 PCN2003-10 - CoolRunner XCR3128XL CPLD Fab Change(PDF, ver 1.0, 116 KB )

PCN2003-10 announces a change in the wafer fabrication facility for the CoolRunner XCR3128XL

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11/08/2002 PCN2002-11 - CoolRunner XCR3256XL - Change in wafer fabrication facility(PDF, ver 1.0, 79 KB )
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12/25/2006 XCN06016 - New Assembly Partner: STATS ChipPAC Singapore (SCS)(PDF, ver 1.1, 115 KB )

The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack (PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire bond (BGA) packages.

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05/17/2006 XCN06013 - Addition of Kostat Shipping Tray for CS144/CSG144 and CS280/CSG280 Laminate BGA Packages(PDF, ver 1.1, 76 KB )

Xilinx is adding shipping trays produced by Kostat, Inc. for the new CS144/CSG144 and CS280/CSG280 Laminate packages.

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04/01/2002 PCN2002-04 - CoolRunner XCR3064XL change in wafer fabrication facility(PDF, ver 1.2, 246 KB )
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12/21/2007 XCN05018 - Package Substrate Change for Chip Scale (Tape) and Lead-Free Chip Scale (Tape)(PDF, ver 1.0.1, 130 KB )

A package substrate change for Chip Scale (Tape) and lead-free Chip Scale (Tape).

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08/07/2006 XCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion(PDF, ver 2.0, 60 KB )

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

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11/14/2002 XCU2000-03 - Addition of PPT as a Substrate Supplier(PDF, ver 1.0, 22 KB )
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07/16/2007 XCN07012 - License Plate Number (LPN) Added to All Customer Labels(PDF, ver 1.0, 164 KB )

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

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07/28/2008 XCN07022 - Product Discontinuation Notice(PDF, ver 1.0.2, 75 KB )

Xilinx is discontinuing certain Spartan®, XC4000XL, CoolRunner™, and Programming Solution products.

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04/26/2010 XCN10017 - Adding SUNRISE Plastics Industry Shipping Tray for 28mm x 28mm QFP Packages and 31mm x 31mm BGA Packages(PDF, ver 1.1, 213 KB )

To advice customers that Xilinx has added alternate shipping tray for 28mm x 28mm QFP packages and 31mm x 31mm BGA packages.

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12/07/2009 XCN09033 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 67 KB )

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

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07/25/2011 XCN11018 - Spartan, Virtex and CoolRunner Series Wire Bond BGA Packaging Material Source Addition(PDF, ver 2.0, 147 KB )

To communicate the addition of new supply sources for wire bond BGA package core and prepreg material for Spartan®/-XL/-II/-IIE/-3/-3E/-3A/-3AN/-3ADSP/-6, XC95XXX, XC95XXXXL, Virtex®, Virtex®-E, Virtex®-II/-ll Pro, and CoolRunner™ and CoolRunner™-II product.

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10/26/2011 XCN11010 - Product Discontinuation Notice(PDF, ver 1.0.1, 267 KB )

To communicate that Xilinx is discontinuing Spartan®-XL FPGA, XC9500 In-System Programmable CPLD products, all Automotive IQ Family offerings of Spartan®-II FPGA products and CoolRunner™ XPLA3 CPLD products.

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CoolRunner XPLA3 Application Notes

DateName
03/06/2009 XAPP058 - Xilinx In-System Programming Using an Embedded Microcontroller(PDF, ver 4.1, 641 KB )

The Xilinx high-performance CPLD, FPGA, and configuration PROM families provide in-system programmability, reliable pin locking, and JTAG boundary-scan test capability. This powerful combination of features allows designers to make significant changes and still keep the original device pin-outs, which eliminates the need to re-tool PC boards.

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04/08/2005 XAPP805 - Driving LEDs with Xilinx CPLDs(PDF, ver 1.0, 254 KB )

This application note describes how to drive LEDs using Xilinx CPLDs.

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06/28/2005 XAPP784 - Bulletproof CPLD Design Practices(PDF, ver 1.0, 112 KB )

Checklist application note giving best practice CPLD design methodology.

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08/30/2001 XAPP105 - A CPLD VHDL Introduction(PDF, ver 2.0, 335 KB )

This introduction covers the basics of VHDL as applied to CPLDs. Specifically included are those design practices that translate well to CPLDs, permitting designers to use the best features of this powerful language to extract the best performance from CPLD designs.

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03/07/2000 XAPP328 - Design of an MP3 Portable Player Using a CoolRunner CPLD(PDF, ver 1.2, 408 KB )

MP3 portable players are the trend in music-listening technology. These players do not include any mechanical movements, thereby making them ideal for listening to music during any type of activity. MP3 is a digital compression technique based on MPEG Layer 3 which stores music in a lot less space than current CD technology. Software is readily available to create MP3 files from an existing CD, and the user can then download these files into a portable MP3 player to be enjoyed in almost any environment.

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09/23/2003 XAPP318 - Power Evaluation Equation for CoolRunner XPLA3 CPLDs(PDF, ver 1.0, 68 KB )

This application note provides a quick and simple method for estimating power consumption of CoolRunner™ XPLA3 CPLDs. As an alternative to XPower, power can be quickly and easily computed using the equation and coefficients provided in this application note.

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10/09/2000 XAPP311 - Five-Volt Tolerance and PCI(PDF, ver 1.2, 60 KB )

The purpose of this application note is to investigate the PCI (Peripheral Component Interface) environment when using 5 volt tolerant, 3.3 volt supply integrated circuits. In particular, we will examine the meaning of the statement "PCI compliant" when used in CPLD or FPGA data sheets.

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09/05/2007 XAPP310 - Power-Up Reset Characteristics of CoolRunner XPLA3 CPLDs(PDF, ver 1.3, 176 KB )

This application note describes power-up characteristics for CoolRunner™ CPLDs that may be of interest, depending upon where and how the devices are used.

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05/25/2006 XAPP440 - Power On Behavior of Xilinx CPLDs(PDF, ver 1.0, 85 KB )

Describes the bahavior of CPLDs during power up.

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12/20/2007 XAPP104 - A Quick JTAG ISP Checklist(PDF, ver 3.0.1, 55 KB )

Most Xilinx CPLDs, PROMs, and FPGAs have an IEEE Standard 1149.1 (JTAG) port. Xilinx devices with a JTAG port are in-system programmable (ISP) through the JTAG port. The ISP feature is beneficial for fast prototype development. This application note describes a short list of considerations needed to get the best performance from your ISP designs.

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10/02/2007 XAPP501 - Configuration Quick Start Guidelines(PDF, ver 1.5, 249 KB )

This application note discusses the configuration and programming options for Xilinx Complex Programmable Logic Device (CPLD), Field Programmable Gate Array (FPGA), and PROM families and demonstrates some of the most popular configuration methods used for each family. This document includes configuration quick start guidelines for the Virtex™, Spartan™, XPLA3, XC9500, and XC18V00 families.

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08/22/2001 XAPP143 - Using Verilog to Create CPLD Designs(PDF, ver 1.0, 377 KB )

This application note covers the basics of how to use Verilog as applied to Complex Programmable Logic Devices. Various combinational logic circuit examples, such as multiplexers, decoders, encoders, comparators, and adders are provided. Synchronous logic circuit examples, such as counters and state machines are also provided.

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12/02/2002 XAPP358 - Wireless Transceiver for the CoolRunner CPLD(PDF, ver 1.2, 296 KB )

This document focuses on the design of a wireless transceiver using CoolRunner™ CPLDs. The wireless transceiver is implemented using the CoolRunner demo board. The wireless transceiver is the perfect application of the low-power capabilities of a CoolRunner CPLD.

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01/03/2002 XAPP355 - Serial ADC Interface Using a CoolRunner CPLD(PDF, ver 1.1, 407 KB )

This document describes the design implementation for controlling a Texas Instruments ADS7870 Analog to Digital Converter (ADC) in a Xilinx CoolRunner™ XPLA3 CPLD. CoolRunner CPLDs are the lowest power CPLD available and the ideal target device for controlling a serial ADC in a portable handheld application. This document provides an explanation of the VHDL code for the CoolRunner CPLD.

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09/30/2002 XAPP354 - Using Xilinx CPLDs to Interface to a NAND Flash Memory Device(PDF, ver 1.1, 417 KB )

This application note describes the use of a Xilinx CoolRunner™ XPLA3 CPLD to implement a NAND Flash memory interface. CoolRunner CPLDs are the lowest power CPLD available and the ideal target device for memory interface applications.

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10/01/2002 XAPP353 - CoolRunner XPLA3 SMBus Controller Implementation(PDF, ver 1.1, 141 KB )

This document details the VHDL implementation of an system Management Bus (SMBus) controller in a Xilinx CoolRunner™ XPLA3 256-macrocell CPLD. CoolRunner CPLDs are the lowest power CPLDs available, making this the perfect target device for an SMBus controller.

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03/30/2004 XAPP352 - Utilizing a User Constraint File for CoolRunner XPLA3 CPLDs(PDF, ver 1.3, 2.11 MB )

This application note provides an introduction to the capabilities and functionality of the User Constraint File (UCF) for CoolRunner™ XPLA3 CPLD designs in WebPACK™ Project Navigator.

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03/25/2005 XAPP349 - CoolRunner XPLA CPLD 8051 Microcontroller Interface(PDF, ver 1.3, 210 KB )

This document details the VHDL implementation of an 8051 microcontroller interface in a Xilinx® CoolRunner™ XPLA3 CPLD. CoolRunner CPLDs are the lowest power CPLDs available, making these CPLDs the perfect interface devices for many of today’s popular microcontrollers.

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12/13/2002 XAPP348 - CoolRunner XPLA3 Serial Peripheral Interface Master(PDF, ver 1.2, 147 KB )

This document details the VHDL implementation of a Serial Peripheral Interface (SPI) master in a Xilinx® CoolRunner™ XPLA3 CPLD. CoolRunner CPLDs are the lowest power CPLDs available, making this the perfect target device for an SPI Master.

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05/16/2001 XAPP347 - Decrease Processor Power Consumption Using a CoolRunner CPLD(PDF, ver 1.0, 83 KB )

This application note describes system design techniques using a low power CoolRunner™ CPLD to reduce overall system power consumption. Utilizing a CoolRunner CPLD to offload operations from the system microprocessor keeps the processor in a power saving mode longer and contributes to significant power savings.

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10/16/2000 XAPP346 - Low Power Tips for CoolRunner Design(PDF, ver 1.0, 280 KB )

This document details specific implementation techniques which may be used to decrease power consumption in CPLD designs.

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12/23/2003 XAPP345 - IrDA and UART Design in a CoolRunner CPLD(PDF, ver 1.3, 276 KB )

This application note illustrates the implementation of an IrDA and UART system using a CoolRunner™ XPLA3 CPLD. The note also describes the fundamental building blocks required to create a half-duplex IrDA and full-duplex UART interface design.

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08/30/2002 XAPP343 - In-System Programming of XPLA3 Devices(PDF, ver 1.0, 60 KB )

This document provides a brief description of how to perform ISP operations with XPLA3 CPLDs.

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06/06/2008 XAPP342 - XPLA3 I/O Cell Characteristics(PDF, ver 1.8, 119 KB )

This document describes the features and benefits of the I/O cells provided by Xilinx® CoolRunner™ XPLA3 CPLDs.

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10/01/2002 XAPP341 - UARTs in Xilinx CPLDs(PDF, ver 1.3, 27 KB )

This application note provides a functional description of VHDL and Verilog source code for a UART. The code is used to target the XC95144 and XCR3128XL CPLDs. This note also discusses the functionality of the UART.

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10/01/2002 XAPP339 - Manchester Encoder-Decoder for Xilinx CPLDs(PDF, ver 1.3, 47 KB )

This application note provides a functional description of VHDL and Verilog source code for a Manchester Encoder Decoder and discusses the reasons to use Manchester code. The code can be compiled into either the Xilinx XC9572 or XCR3064XL CPLD.

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01/15/2003 XAPP336 - Design of a 16b/20b Encoder/Decoder Using a CoolRunner CPLD(PDF, ver 1.3, 344 KB )

This document details the VHDL implementation of a fibre channel byte-oriented transmission encoder and decoder in a Xilinx® CoolRunner™ CPLD. CoolRunner CPLDs are the lowest power CPLDs available today and can be utilized in any network design where reliable point-to-point transceivers are required. CoolRunner CPLDs utilize the patented Fast Zero Power (FZP) design technique to simultaneously deliver high performance and low power consumption. These devices offer pin-to-pin delays of 5.0 ns, and less than 100 µA of standby current (approximately 1/3 of the power consumed by other competing CPLDs at fMAX ).

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04/17/2000 XAPP335 - Macrocell Configurations in CoolRunner XPLA3 CPLDs(PDF, ver 1.0, 102 KB )

This document describes the macrocell configurations of Xilinx® CoolRunner™ XPLA CPLDs.

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01/31/2000 XAPP334 - Utilizing XPLA3 Universal Control Terms(PDF, ver 1.0, 66 KB )

This document highlights the advantages of utilizing the universal control terms provided in the CoolRunner™ XPLA3 CPLD architecture. This application note also discusses design examples showing the efficiency of these universal control terms.

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12/30/2003 XAPP333 - CoolRunner XPLA3 I2C Bus Controller Implementation(PDF, ver 1.8, 150 KB )

This document details the VHDL implementation of an I2C controller in a Xilinx CoolRunner XPLA3 256 macrocell CPLD. CoolRunner CPLDs are the lowest power CPLDs available, making this the perfect target device for an I2C controller.

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10/09/2000 XAPP329 - Understanding True CMOS Outputs(PDF, ver 1.1, 67 KB )

This document provides a description of the CMOS output structures of the CoolRunner™ CPLDs and details some advantages of using true CMOS (rail-to-rail capable) output drivers.

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02/07/2008 XAPP1047 - CPLD Timing(PDF, ver 1.0, 242 KB )

This application note describes how to enter timing constraints for CPLDs, and how to verify that your timing contraints have been met.

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CoolRunner XPLA3 Package Specifications

DateName
09/28/2006 CS48 - Material Declaration Data Sheet (Standard Chip Scale BGA)(PDF, ver 1.2, 83 KB )

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09/28/2006 CP56 - Material Declaration Data Sheet (Standard Chip Scale BGA)(PDF, ver 1.2, 81 KB )

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01/08/2007 BG256 - Material Declaration Data Sheet (Standard Plastic BGA)(PDF, ver 1.2.1, 79 KB )

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10/19/2006 PQG208 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.2.1, 80 KB )

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09/28/2006 HQG208 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP)(PDF, ver 1.2, 83 KB )

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09/21/2006 FGG324 - Material Declaration Data Sheet (Pb-free Fine-Pitch BGA)(PDF, ver 1.2, 85 KB )

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09/28/2006 CSG144 - Material Declaration Data Sheet (Pb-free Laminate Chip Scale BGA)(PDF, ver 1.2, 85 KB )

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09/28/2006 CSG48 - Material Declaration Data Sheet (Pb-free Chip Scale BGA)(PDF, ver 1.3, 86 KB )

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09/28/2006 CPG56 - Material Declaration Data Sheet (Pb-free Chip Scale BGA)(PDF, ver 1.2, 85 KB )

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06/18/2004 HT144/HTG144 - Package Drawing (Heat Sink TQFP)(PDF, ver 1.2, 148 KB )
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06/18/2004 HQ208/HQG208 - Package Drawing (Heat Sink PQFP)(PDF, ver 1.2, 155 KB )
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03/23/2005 FG324/FGG324 - Package Drawing (Fine-Pitch BGA)(PDF, ver 1.2.1, 99 KB )
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06/18/2004 PC44/PCG44 - Package Drawing (PLCC)(PDF, ver 1.2, 90 KB )
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04/12/2005 CS48/CSG48 - Package Drawing (Chip Scale BGA)(PDF, ver 1.2.1, 74 KB )
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12/05/2005 CS280/CSG280 - Package Drawing (Laminate Chip Scale BGA)(PDF, ver 1.0, 62 KB )
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11/29/2005 CS280/CSG280 - Package Drawing (Flex Tape Chip Scale BGA)(PDF, ver 1.2.2, 58 KB )
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05/31/2006 CS144/CSG144 - Package Drawing (Laminate Chip Scale BGA)(PDF, ver 1.1, 69 KB )
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01/15/2007 CS144/CSG144 - Package Drawing (Flex Tape Chip Scale BGA)(PDF, ver 1.3, 49 KB )
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07/09/2008 CP56/CPG56 - Package Drawing (Chip Scale BGA)(PDF, ver 1.3, 53 KB )
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04/06/2001 BG492 - Package Drawing (Standard Plastic BGA)(PDF, ver 1.0, 48 KB )
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03/19/2007 BG256/BGG256 - Package Drawing (Plastic BGA)(PDF, ver 1.3, 98 KB )
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10/03/2006 TQ144 - Material Declaration Data Sheet (Standard TQFP)(PDF, ver 1.2, 81 KB )

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10/19/2006 PQ208 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 109 KB )

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10/03/2006 HQ208 - Material Declaration Data Sheet (Standard Heat Sink PQFP)(PDF, ver 1.2, 85 KB )

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06/18/2004 VQ44/VQG44 - Package Drawing (VQFP)(PDF, ver 1.2, 121 KB )
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02/26/2007 VQ100/VQG100 - Package Drawing (VQFP)(PDF, ver 1.2.1, 99 KB )
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06/18/2004 PQ44/PQG44 - Package Drawing (PQFP)(PDF, ver 1.2, 154 KB )
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06/18/2004 PQ208/PQG208 - Package Drawing (PQFP)(PDF, ver 1.2, 155 KB )
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10/05/2006 PQG44 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.0, 75 KB )

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10/05/2006 PQ44 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.0, 82 KB )

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10/05/2006 CSG280 - Material Declaration Data Sheet (Pb-free Flex Tape Chip Scale BGA)(PDF, ver 1.0, 75 KB )

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09/29/2006 PC44 - Material Declaration Data Sheet (Standard PLCC)(PDF, ver 1.2, 78 KB )

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09/21/2006 FG324 - Material Declaration Data Sheet (Standard Fine-Pitch BGA)(PDF, ver 1.2, 90 KB )

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06/18/2004 TQ144/TQG144 - Package Drawing (TQFP)(PDF, ver 1.2, 147 KB )
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10/19/2006 TQG144 - Material Declaration Data Sheet (Pb-free TQFP)(PDF, ver 1.2.1, 80 KB )

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09/21/2006 FT256 - Material Declaration Data Sheet (Standard Fine-Pitch Thin BGA)(PDF, ver 1.2, 83 KB )

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03/23/2011 FT256/FTG256 - Package Drawing (Fine-Pitch Thin BGA)(application/x-download, ver 1.4, 113 KB )
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07/29/2011 PCG44 - Material Declaration Data Sheet (Pb-free PLCC)(PDF, ver 1.3, 96 KB )

100% Material Data Declaration Sheet (Pb-free PLCC)

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09/23/2011 VQ100 - Material Declaration Data Sheet (Standard VQFP)(PDF, ver 1.3, 93 KB )

100% Material Declaration Data Sheet for VQ100 package

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11/18/2011 VQG44 - Material Declaration Data Sheet (Pb-free VQFP)(PDF, ver 1.3, 93 KB )

VQG44 - Material Declaration Data Sheet (Pb-free VQFP)

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11/18/2011 VQG100 - Material Declaration Data Sheet (Pb-free VQFP)(PDF, ver 1.3, 93 KB )

VQG100 - Material Declaration Data Sheet (Pb-free VQFP)

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11/18/2011 VQ44 - Material Declaration Data Sheet (Standard VQFP)(PDF, ver 1.3, 93 KB )

100% Material Declaration Data Sheet for VQ44 package

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09/28/2006 CS144 - Material Declaration Data Sheet (Standard Chip Scale BGA)(PDF, ver 1.2, 81 KB )

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10/05/2006 CS280 - Material Declaration Data Sheet (Standard Laminate Chip Scale BGA)(PDF, ver 1.0, 78 KB )

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09/15/2011 FTG256 - Material Declaration Data Sheet (Pb-free Fine-Pitch Thin BGA)(PDF, ver 1.3, 144 KB )

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CoolRunner XPLA3 White Papers

DateName
01/10/2005 WP214 - TTL "Burn Rate" for Xilinx CPLDs(PDF, ver 1.0, 1.35 MB )

This White Paper shows a method for calculating how much TTL logic can be fit on a Xilinx CPLD.

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05/18/2002 WP122 - Using the CoolRunner XPLA3 Timing Model (PDF, ver 1.2, 103 KB )

This document describes how to use the CoolRunner XPLA3 timing model.

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09/13/2000 WP108 - CoolRunner XPLA3 Clocking Options(PDF, ver 1.0, 58 KB )

This document gives a detailed description of the CoolRunner XPLA3 clocking options.

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01/06/2000 WP105 - CoolRunner XPLA3 CPLD Architecture Overview(PDF, ver 1.0, 237 KB )

This white paper describes the CoolRunner™ XPLA3 CPLD architecture.

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