Main

XC9500

Subscribe to Alerts | for notification of new or changed documents related to your product of interest.

Open a Case | If you have a question about Xilinx documentation, please submit a case to Technical Support.

Download Documentation Navigator | To intuitively find, filter and download documents.

Jump to:  

XC9500 Data Sheets

DateName
05/28/2009 XC95144 In-System Programmable CPLD(PDF, ver 5.7, 272 KB )

The XC95144 is a high-performance CPLD providing advanced in-system programming and test capabilities for general purpose logic integration. It is comprised of eight 36V18 Function Blocks, providing 3,200 usable gates with propagation delays of 7.5 ns.

Was this document helpful? Yes | No
06/25/2007 XC9500 5V In-System Programmable CPLD Family(PDF, ver 5.5, 169 KB )

The XC9500 CPLD family provides advanced in-system programming and test capabilities for high performance, general purpose logic integration. All devices are in-system programmable for a minimum of 10,000 program/erase cycles.

Was this document helpful? Yes | No
04/03/2006 XC95288 5V In-System Programmable CPLD(PDF, ver 4.3, 115 KB )

Data Sheet for 288 Macrocell In-System Programmable CPLD

Was this document helpful? Yes | No
06/25/2007 XC95216 5V In-System Programmable CPLD(PDF, ver 4.4, 100 KB )

Data Sheet for 216 Macrocell 5V In-System Programmable CPLD

Was this document helpful? Yes | No
04/03/2006 XC95108 In-System Programmable CPLD(PDF, ver 4.4, 190 KB )

The XC95108 is a high-performance CPLD providing advanced in-system programming and test capabilities for general purpose logic integration. It is comprised of eight 36V18 Function Blocks, providing 2,400 usable gates with propagation delays of 7.5 ns.

Was this document helpful? Yes | No
04/03/2006 XC9572 5V In-System Programmable CPLD(PDF, ver 4.5, 104 KB )

Data Sheet for 72 macrocell 5V programmable CPLD

Was this document helpful? Yes | No
04/03/2006 XC9536 5V In-System Programmable CPLD(PDF, ver 6.3, 99 KB )

Data Sheet for 36 Macrocell 5V Programmable CPLD

Was this document helpful? Yes | No

XC9500 User Guides

DateName
11/27/2007 CPLD I/O User Guide(PDF, ver 1.1, 610 KB )

This document describes the behavior of the I/Os under various operating conditions. It describes how to use the different termination modes, how to understand thresholds, and how loading affects the I/Os.

Was this document helpful? Yes | No
09/22/2010 Device Package User Guide(PDF, ver 3.6, 4.89 MB )

This document discusses thermal, electrical, moisture, and soldering characteristics of Xilinx® device packages.

Was this document helpful? Yes | No
05/08/2012 Device Reliability Report, First Quarter 2012(PDF, ver 9.0, 2.18 MB )

Summary of the reliability test data and results for Xilinx devices updated four times per year.

Was this document helpful? Yes | No

XC9500 Customer Notices

DateName
11/14/2002 XCU2000-03 - Addition of PPT as a Substrate Supplier(PDF, ver 1.0, 22 KB )
Was this document helpful? Yes | No
07/16/2007 XCN07012 - License Plate Number (LPN) Added to All Customer Labels(PDF, ver 1.0, 164 KB )

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

Was this document helpful? Yes | No
12/25/2006 XCN06016 - New Assembly Partner: STATS ChipPAC Singapore (SCS)(PDF, ver 1.1, 115 KB )

The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack (PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire bond (BGA) packages.

Design File(s):

Was this document helpful? Yes | No
08/07/2006 XCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion(PDF, ver 2.0, 60 KB )

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

Design File(s):

Was this document helpful? Yes | No
07/01/1999 PDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families(PDF, ver 1.0, 24 KB )
Was this document helpful? Yes | No
07/24/1998 PCN98003 - The Xilinx XC9500 Product Family will be manufactured in the 0.5uM Flash Process at UMC(PDF, ver 1.0, 24 KB )
Was this document helpful? Yes | No
06/24/1998 PCN98003 Data - Qualification Test Data(PDF, ver 1.0, 34 KB )
Was this document helpful? Yes | No
10/29/1997 PCN97009A - A reissue of a minor enhancement to the Xilinx line of thermally enhanced quad flatpack (PDF, ver 1.0, 19 KB )
Was this document helpful? Yes | No
10/29/1997 PCN97009A Data(2) - Reliability Testing of the HQ240 Package (Insulated Heatsink)(PDF, ver 1.0, 13 KB )
Was this document helpful? Yes | No
10/29/1997 PCN97009A Data - Thermal Data for Thermally Enhanced Plastic Quad Flat Pack (PQFP)(PDF, ver 1.0, 13 KB )
Was this document helpful? Yes | No
12/06/2004 PCN2004-28 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 161 KB )

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

Was this document helpful? Yes | No
12/06/2004 PCN2004-05 - New Material Set and Part Marking for Chip Scale BGA Packages(PDF, ver 1.1, 72 KB )
Was this document helpful? Yes | No
12/06/2004 PCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material)(PDF, ver 1.1, 72 KB )
Was this document helpful? Yes | No
03/13/2007 PCN2000-06 - Minor Modification in Thermally Enhanced BG and FG Package Outline Specifications(PDF, ver 1.0.1, 41 KB )
Was this document helpful? Yes | No
08/19/2003 Advisory 2003-02 - Change in BGA Shipping Trays(PDF, ver 1.0, 43 KB )

Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both Daewon and Kostat.

Was this document helpful? Yes | No
04/26/2010 XCN10017 - Adding SUNRISE Plastics Industry Shipping Tray for 28mm x 28mm QFP Packages and 31mm x 31mm BGA Packages(PDF, ver 1.1, 213 KB )

To advice customers that Xilinx has added alternate shipping tray for 28mm x 28mm QFP packages and 31mm x 31mm BGA packages.

Was this document helpful? Yes | No
04/26/2010 XCN07010 - Product Discontinuance Update(PDF, ver 1.1, 77 KB )

This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx.

Was this document helpful? Yes | No
12/07/2009 XCN09033 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 67 KB )

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

Was this document helpful? Yes | No
07/19/2010 XCN09001 - Product Discontinuation Notice(PDF, ver 1.4.2, 259 KB )

To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products.

Was this document helpful? Yes | No
07/25/2011 XCN11018 - Spartan, Virtex and CoolRunner Series Wire Bond BGA Packaging Material Source Addition(PDF, ver 2.0, 147 KB )

To communicate the addition of new supply sources for wire bond BGA package core and prepreg material for Spartan®/-XL/-II/-IIE/-3/-3E/-3A/-3AN/-3ADSP/-6, XC95XXX, XC95XXXXL, Virtex®, Virtex®-E, Virtex®-II/-ll Pro, and CoolRunner™ and CoolRunner™-II product.

Was this document helpful? Yes | No
10/26/2011 XCN11010 - Product Discontinuation Notice(PDF, ver 1.0.1, 267 KB )

To communicate that Xilinx is discontinuing Spartan®-XL FPGA, XC9500 In-System Programmable CPLD products, all Automotive IQ Family offerings of Spartan®-II FPGA products and CoolRunner™ XPLA3 CPLD products.

Was this document helpful? Yes | No

XC9500 Application Notes

DateName
04/08/2005 XAPP805 - Driving LEDs with Xilinx CPLDs(PDF, ver 1.0, 254 KB )

This application note describes how to drive LEDs using Xilinx CPLDs.

Was this document helpful? Yes | No
02/16/1998 XAPP110 - XC9500 CPLD Power Sequencing(PDF, ver 1.0, 29 KB )

Mixed signal systems require logic parts that can operate with two power supplies. XC9500™ CPLDs are designed to operate in either mixed 5V/3.3V systems or 5V-only systems. To handle both conditions, care has been taken to ensure that designers need not introduce elaborate circuitry to guarantee that 5V and 3.3V power supplies rise or fall in any particular sequence. This application note describes the underlying XC9500 circuitry to give designers the understanding they need to best use these CPLDs.

Was this document helpful? Yes | No
08/30/2001 XAPP105 - A CPLD VHDL Introduction(PDF, ver 2.0, 335 KB )

This introduction covers the basics of VHDL as applied to CPLDs. Specifically included are those design practices that translate well to CPLDs, permitting designers to use the best features of this powerful language to extract the best performance from CPLD designs.

Was this document helpful? Yes | No
10/02/2007 XAPP501 - Configuration Quick Start Guidelines(PDF, ver 1.5, 249 KB )

This application note discusses the configuration and programming options for Xilinx Complex Programmable Logic Device (CPLD), Field Programmable Gate Array (FPGA), and PROM families and demonstrates some of the most popular configuration methods used for each family. This document includes configuration quick start guidelines for the Virtex™, Spartan™, XPLA3, XC9500, and XC18V00 families.

Was this document helpful? Yes | No
05/25/2006 XAPP440 - Power On Behavior of Xilinx CPLDs(PDF, ver 1.0, 85 KB )

Describes the bahavior of CPLDs during power up.

Was this document helpful? Yes | No
05/15/2001 XAPP150 - I/V Curves for Various Device Families(PDF, ver 1.1, 138 KB )

These typical curves describe the output sink and source current for average processing, nominal supply voltage and room temperature. (For Virtex™ FPGAs, see XAPP135.) For additional data, see the Xilinx™ IBIS files.

Was this document helpful? Yes | No
03/14/2000 XAPP144 - Designing CPLD Multi-voltage Systems(PDF, ver 1.3, 66 KB )

This application note discusses XC9500XL™ device use in multi-voltage systems.

Was this document helpful? Yes | No
08/22/2001 XAPP143 - Using Verilog to Create CPLD Designs(PDF, ver 1.0, 377 KB )

This application note covers the basics of how to use Verilog as applied to Complex Programmable Logic Devices. Various combinational logic circuit examples, such as multiplexers, decoders, encoders, comparators, and adders are provided. Synchronous logic circuit examples, such as counters and state machines are also provided.

Was this document helpful? Yes | No
12/20/2007 XAPP104 - A Quick JTAG ISP Checklist(PDF, ver 3.0.1, 55 KB )

Most Xilinx CPLDs, PROMs, and FPGAs have an IEEE Standard 1149.1 (JTAG) port. Xilinx devices with a JTAG port are in-system programmable (ISP) through the JTAG port. The ISP feature is beneficial for fast prototype development. This application note describes a short list of considerations needed to get the best performance from your ISP designs.

Was this document helpful? Yes | No
01/01/1997 XAPP071 - Using the XC9500 Timing Model(PDF, ver 1.0, 38 KB )

This application note describes how to use the XC9500™ timing model. All XC9500 CPLDs have a uniform architecture and an identical timing model, making them very easy to use and understand. To determine specific timing details, users need only compare their paths of interest to the architectural diagrams and, using the timing model presented here, perform a simple addition of incremental time delays.

Was this document helpful? Yes | No
11/15/2007 XAPP070 - Using In-System Programming in Boundary-Scan Systems(PDF, ver 2.1.1, 136 KB )

This application note discusses basic design considerations for in-system programming of multiple XC9500 devices in a boundary scan chain, and shows how to design systems that contain multiple XC9500 devices as well as other IEEE 1149.1-compatible devices.

Was this document helpful? Yes | No
12/10/2002 XAPP069 - Using the XC9500 JTAG Boundary Scan Interface  (PDF, ver 3.1, 464 KB )

This application note explains the XC9500™ boundary scan interface and demonstrates the software available for programming and testing XC9500 CPLDs. An appendix summarizes the JTAG programmer operations and surveys the additional operations supported by XC9500 CPLDs for in-system programming.

Was this document helpful? Yes | No
05/13/2002 XAPP067 - Using Serial Vector Format Files to Program XC9500 Devices In-System(PDF, ver 2.0, 123 KB )

This application note describes how to program XC9500™ devices in-system, using standard Serial Vector Format (SVF) stimulus files.

Was this document helpful? Yes | No
02/07/2008 XAPP1047 - CPLD Timing(PDF, ver 1.0, 242 KB )

This application note describes how to enter timing constraints for CPLDs, and how to verify that your timing contraints have been met.

Was this document helpful? Yes | No
03/06/2009 XAPP058 - Xilinx In-System Programming Using an Embedded Microcontroller(PDF, ver 4.1, 641 KB )

The Xilinx high-performance CPLD, FPGA, and configuration PROM families provide in-system programmability, reliable pin locking, and JTAG boundary-scan test capability. This powerful combination of features allows designers to make significant changes and still keep the original device pin-outs, which eliminates the need to re-tool PC boards.

Design File(s):

Was this document helpful? Yes | No

XC9500 Package Specifications

DateName
01/08/2007 BGG352 - Material Declaration Data Sheet (Pb-free Metal BGA Cavity Down)(PDF, ver 1.0.1, 83 KB )

Design File(s):

Was this document helpful? Yes | No
01/08/2007 BG352 - Material Declaration Data Sheet (Standard Metal BGA Cavity Down)(PDF, ver 1.0.1, 81 KB )

Design File(s):

Was this document helpful? Yes | No
09/29/2006 TQ100 - Material Declaration Data Sheet (Standard TQFP)(PDF, ver 1.2, 81 KB )

Design File(s):

Was this document helpful? Yes | No
10/19/2006 PQ208 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 109 KB )

Design File(s):

Was this document helpful? Yes | No
10/19/2006 PQ160 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 81 KB )

Design File(s):

Was this document helpful? Yes | No
10/19/2006 PQ100 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.3.1, 82 KB )

Design File(s):

Was this document helpful? Yes | No
10/03/2006 HQ208 - Material Declaration Data Sheet (Standard Heat Sink PQFP)(PDF, ver 1.2, 85 KB )

Design File(s):

Was this document helpful? Yes | No
09/29/2006 PD8 - Material Declaration Data Sheet (Standard Plastic DIP)(PDF, ver 1.2, 81 KB )

Design File(s):

Was this document helpful? Yes | No
06/18/2004 VQ44/VQG44 - Package Drawing (VQFP)(PDF, ver 1.2, 121 KB )
Was this document helpful? Yes | No
06/18/2004 TQ100/TQG100 - Package Drawing (TQFP)(PDF, ver 1.2, 147 KB )
Was this document helpful? Yes | No
06/18/2004 PQ208/PQG208 - Package Drawing (PQFP)(PDF, ver 1.2, 155 KB )
Was this document helpful? Yes | No
06/18/2004 PQ160/PQG160 - Package Drawing (PQFP)(PDF, ver 1.2, 154 KB )
Was this document helpful? Yes | No
10/17/2002 PQ100 - Package Drawing (Standard PQFP)(PDF, ver 1.2, 73 KB )
Was this document helpful? Yes | No
09/29/2006 PC44 - Material Declaration Data Sheet (Standard PLCC)(PDF, ver 1.2, 78 KB )

Design File(s):

Was this document helpful? Yes | No
09/28/2006 CS48 - Material Declaration Data Sheet (Standard Chip Scale BGA)(PDF, ver 1.2, 83 KB )

Design File(s):

Was this document helpful? Yes | No
10/19/2006 TQG100 - Material Declaration Data Sheet (Pb-free TQFP)(PDF, ver 1.2.1, 80 KB )

Design File(s):

Was this document helpful? Yes | No
10/19/2006 PQG160 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.2.1, 81 KB )

Design File(s):

Was this document helpful? Yes | No
10/19/2006 PQG100 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.3.1, 81 KB )

Design File(s):

Was this document helpful? Yes | No
09/28/2006 HQG208 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP)(PDF, ver 1.2, 83 KB )

Design File(s):

Was this document helpful? Yes | No
09/28/2006 PDG8 - Material Declaration Data Sheet (Pb-free Plastic DIP)(PDF, ver 1.2, 80 KB )

Design File(s):

Was this document helpful? Yes | No
09/28/2006 CSG48 - Material Declaration Data Sheet (Pb-free Chip Scale BGA)(PDF, ver 1.3, 86 KB )

Design File(s):

Was this document helpful? Yes | No
06/18/2004 PC44/PCG44 - Package Drawing (PLCC)(PDF, ver 1.2, 90 KB )
Was this document helpful? Yes | No
06/18/2004 HT100/HTG100 - Package Drawing (Heat Sink TQFP)(PDF, ver 1.2, 148 KB )
Was this document helpful? Yes | No
06/18/2004 HQ208/HQG208 - Package Drawing (Heat Sink PQFP)(PDF, ver 1.2, 155 KB )
Was this document helpful? Yes | No
06/18/2004 HQ160/HQG160 - Package Drawing (Heat Sink PQFP)(PDF, ver 1.2, 155 KB )
Was this document helpful? Yes | No
04/06/2001 PD08 - Package Drawing (Standard Plastic DIP)(PDF, ver 1.1, 28 KB )
Was this document helpful? Yes | No
04/12/2005 CS48/CSG48 - Package Drawing (Chip Scale BGA)(PDF, ver 1.2.1, 74 KB )
Was this document helpful? Yes | No
04/06/2001 BG352 - Package Drawing (Standard Metal BGA Cavity Down)(PDF, ver 1.1, 50 KB )
Was this document helpful? Yes | No
11/18/2011 VQG44 - Material Declaration Data Sheet (Pb-free VQFP)(PDF, ver 1.3, 93 KB )

VQG44 - Material Declaration Data Sheet (Pb-free VQFP)

Design File(s):

Was this document helpful? Yes | No
11/18/2011 VQ44 - Material Declaration Data Sheet (Standard VQFP)(PDF, ver 1.3, 93 KB )

100% Material Declaration Data Sheet for VQ44 package

Design File(s):

Was this document helpful? Yes | No

XC9500 White Papers

DateName
01/10/2005 WP214 - TTL "Burn Rate" for Xilinx CPLDs(PDF, ver 1.0, 1.35 MB )

This White Paper shows a method for calculating how much TTL logic can be fit on a Xilinx CPLD.

Was this document helpful? Yes | No
 
 
/csi/footer.htm